JPH03112950U - - Google Patents

Info

Publication number
JPH03112950U
JPH03112950U JP1990021471U JP2147190U JPH03112950U JP H03112950 U JPH03112950 U JP H03112950U JP 1990021471 U JP1990021471 U JP 1990021471U JP 2147190 U JP2147190 U JP 2147190U JP H03112950 U JPH03112950 U JP H03112950U
Authority
JP
Japan
Prior art keywords
circuit pattern
switch
switch contact
pair
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990021471U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087643Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990021471U priority Critical patent/JPH087643Y2/ja
Priority to KR1019910002989A priority patent/KR0165544B1/ko
Priority to US07/662,522 priority patent/US5264656A/en
Priority to GB9104356A priority patent/GB2243479B/en
Priority to DE4106824A priority patent/DE4106824A1/de
Priority to FR9102621A priority patent/FR2659164B1/fr
Publication of JPH03112950U publication Critical patent/JPH03112950U/ja
Application granted granted Critical
Publication of JPH087643Y2 publication Critical patent/JPH087643Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Contacts (AREA)
JP1990021471U 1990-03-05 1990-03-05 回路パターンの構造 Expired - Fee Related JPH087643Y2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1990021471U JPH087643Y2 (ja) 1990-03-05 1990-03-05 回路パターンの構造
KR1019910002989A KR0165544B1 (ko) 1990-03-05 1991-02-25 전자발음장치
US07/662,522 US5264656A (en) 1990-03-05 1991-02-28 Electronic sound generating device
GB9104356A GB2243479B (en) 1990-03-05 1991-03-01 Electronic sound generating device
DE4106824A DE4106824A1 (de) 1990-03-05 1991-03-04 Elektronische schallerzeugervorrichtung und verfahren zu ihrer herstellung
FR9102621A FR2659164B1 (en]) 1990-03-05 1991-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990021471U JPH087643Y2 (ja) 1990-03-05 1990-03-05 回路パターンの構造

Publications (2)

Publication Number Publication Date
JPH03112950U true JPH03112950U (en]) 1991-11-19
JPH087643Y2 JPH087643Y2 (ja) 1996-03-04

Family

ID=12055893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990021471U Expired - Fee Related JPH087643Y2 (ja) 1990-03-05 1990-03-05 回路パターンの構造

Country Status (1)

Country Link
JP (1) JPH087643Y2 (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116962A (en) * 1974-08-01 1976-02-10 Suwa Seikosha Kk Denshidokeiniokeru suitsuchikiko
JPS6142037U (ja) * 1984-08-22 1986-03-18 株式会社東芝 多連スイツチ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116962A (en) * 1974-08-01 1976-02-10 Suwa Seikosha Kk Denshidokeiniokeru suitsuchikiko
JPS6142037U (ja) * 1984-08-22 1986-03-18 株式会社東芝 多連スイツチ

Also Published As

Publication number Publication date
JPH087643Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees